Researchers at Fudan University have achieved a breakthrough by fabricating the first Field-Programmable Gate Array (FPGA) based on wafer-scale two-dimensional (2D) semiconductor materials.

Researchers have introduced a novel technique that allows for the direct patterning of two-dimensional (2D) semiconductor materials onto substrates without the need for complex processes. The ...

A technical paper titled “Challenges of Wafer-Scale Integration of 2D Semiconductors for High-Performance Transistor Circuits” was published by researchers at Imec. “The introduction of highly scaled ...