IBM says building better microchips is kind of like baking a cake. Researchers at Big Blue have devised a new 3D circuit design that uses two or more layers of transistors, the basic building blocks ...

3D-MID technology integrates electronic and mechanical functions into a single three-dimensional structure. Unlike traditional printed circuit boards (PCBs), which are flat, 3D-Circuits (3D-MID) ...

The pedagogical model of the integrated circuit goes something like this: take a silicone wafer, etch out a few wells, dope some of the silicon with phosphorous, mask some of the chip off, dope some ...

After several years of experimentation, and growing success in volume manufacturing for some use cases, technologies for 3D printing of electronic circuits are becoming more common. Some innovations ...

A research team led by Associate Professor Benjamin Tee from the Department of Materials Science and Engineering in the NUS College of Design and Engineering used Field’s metal to show how CHARM3D can ...

The MediSpec Molded Interconnect Device (MID) 3D circuit capability uses Laser Directed Structuring (LDS) technology to integrate electrical and mechanical design into a single molded device for ...

Designing flexible electronics has long been constrained by the limits of two-dimensional printing. Now, researchers have introduced a novel method that “draws” rather than extrudes ink into air, ...

Building a circuit Manhattan style with small bits of copper and solder is a skill all its own, and building a prototype dead bug style is close to a black art. [Anderson] is taking it to the next ...