Luton, Bedfordshire, United Kingdom, July 18, 2024 (GLOBE NEWSWIRE) -- Exactitude Consultancy, the market research and consulting wing of Ameliorate Digital Consultancy Private Limited has completed ...
Mobile devices, like cell phones and portable game consoles, require memory systems that meet two key requirements: low power dissipation and high packaging density. In order to meet these ...
2.5D and 3D packaging technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...
If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...
As microelectromechanical-systems (MEMS) ICs satisfy more functions and proliferate, packaging them into high-density form factors like 3D becomes more of a challenge than conventional ICs. To ...
It's rare to see a new kind of material used for packaging, but it's even rarer when that material is highly sustainable and centuries old. The breakthrough new, yet old packaging that mimics ancient ...
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