For CES 2026, this year’s show continues to center on the theme of “AI Everywhere,” with the spotlight returning to on-device AI PC applications. The report notes that amid rising memory costs, the ...
The post TSMC Accelerates U.S. 3nm Chip Production to 2027, One Year Ahead of Schedule appeared first on Android Headlines.
Xiaomi awards its XRING O1 3nm chip team and outlines plans to unify its own chip, OS, and AI model by 2026 as R&D investment grows.
TSM is dominating the global AI economy with its cutting-edge chips, attracting big clients like Nvidia and AMD.
GUC is pleased to announce that it’s industry-leading 3nm HBM4E IP has been honored with the Five-Year Achievement Award – Engineers’ Choice Best EDA & IP / Processor at the EE Awards Asia 2025, ...
Xiaomi’s second-generation in-house chip, the Xring 02, will debut in 2026. However, the chip will reportedly stick to TSMC’s 3nm process. This comes as a disappointment at a time when the competition ...
Xiaomi is set to unveil its latest slate of strategic products at 7 pm CST on May 22, headlined by the long-awaited debut of its in-house smartphone SoC, the XRing O1—a bold play that marks a new ...
According to a new report from Reuters (spotted by Thurrott), OpenAI could finalize the design of its first 3nm AI chip in the coming months, with the goal of starting mass production at TSMC in 2026.
Google’s expected to shift to TSMC for production of the Tensor G5 chip in the Pixel 10. While the Tensor G5 will be fabricated on a 3nm process, industry rumors claim the G6 will already move down to ...
The post Qualcomm & MediaTek to use TSMC's Improved 2nm N2P Node To Edge Out Apple's A20 Chip appeared first on Android ...
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