Manufacturers of ball-grid-array (BGA) burn-in sockets are using a variety of processes to help them keep pace with the testing requirements posed by today's faster and denser integrated circuits.
Oyster Bay, N. Y. – Designed to socket BGA devices and interconnect circuit boards, Mill-Max's BGA Socket/Adapter Systems are now available in three grid sizes to fit 0.8-mm, 1.0-mm and .050-in. grid ...
The Configurable High Insertion Count (CHIC) Socket lets users of programming and automatic test equipment accommodate any BGA package. It improves electrical contact reliability compared to ...
Ironwood Electronics has recently introduced a new BGA socket design using high-performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2086 socket is ...
BGA socket adapter provide an inexpensive and reliable interconnect for attaching BGA chips to target board. These adapters have less than half of the insertion force of competitive adapters, shorter ...
It was almost a year ago when we first heard details about AMD's plans for its top-dog mobile part for Zen 5, which goes by the name Strix Halo. For Zen 5 in laptops, AMD is developing two lines of ...
GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative ...
TL;DR: Intel's upcoming Nova Lake-HX high-performance laptop processors will use the larger BGA 2540 socket, succeeding Arrow Lake-HX with up to 48 cores and enhanced performance. These mobile CPUs ...
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