AI agents capable of handling large portions of chip design and verification are less about convenience and more about ...

Researchers led by Assoc. Prof. Dr. Savaş Taşoğlu from the Department of Mechanical Engineering at Koç University have ...

The company said Cadence ChipStack AI Super Agent will help revolutionize how engineers automate chip design by improving ...

What if students could design real chips, run them on silicon and learn hands-on? India’s new open source PDK flow is making ...

Heat limits sub-10 nm chips, but current tools miss nanoscale effects or run too slowly. New modeling bridges atom-level ...

HSINCHU, TAIWAN - SEPTEMBER 16: A closeup of a silicon wafer on display at Taiwan Semiconductor Research Institution on September 16, 2022 in Hsinchu, Taiwan. Taiwan's semiconductor manufacturing ...

For decades, the design of leading-edge chips has been a high-wire act—balancing tight deadlines, sophisticated workflows, and the relentless need to consult scattered, often outdated, sources of ...

Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...

This is a sponsored article brought to you by Siemens. In the world of electronics, integrated circuits (IC) chips are the unseen powerhouse behind progress. Every leap—whether it’s smarter phones, ...

AI’s demand for compute is rapidly outpacing current power infrastructure. According to Goldman Sachs Global Institute, ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...