Rib parts (top) trialed using spring-frame molding (shown here, bottom, with curved C-channel part) and double diaphragm forming (DDF) processes in the DARPA-funded and Boeing co-funded RAPM program ...
Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
Injection overmolding of unidirectional fibers and preforms is an attractive process for many good reasons. It’s fast, consistent and repeatable, and it can be performed with a machine that is ...
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