In the recent semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting and ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding technology To highlight RF‑SiP substrates that adopt a groundbreaking application of Cu‑Post ...

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples... LG Innotek is seeking to enter Tesla's AI semiconductor ...

LG Innotek's supply of mobile semiconductor substrates is reportedly expanding. As rival corporations focus on producing high-value flip-chip (FC) ball grid array (BGA) substrates, where demand is ...

CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

Topoint Technology, which manufactures drill bits for the production of IC substrates and PCBs, has reported net profits of NT$274 million (US$9.21 million) for 2012, down 9.6% from... Consolidated ...

LG Innotek has decided to significantly expand its semiconductor substrate business, which is experiencing surging demand in ...

LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip ...