In-design verification is needed to shorten design cycles and maximize circuit performance, ensuring physical designs are correct by construction. Physical verification often forces a decision between ...
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...
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AI learns to perform analog layout design
Researchers at Pohang University of Science and Technology (POSTECH) have developed an artificial intelligence approach that addresses a key bottleneck in analog semiconductor layout design, a process ...
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