Intel is unveiling packaging innovations for creating three-dimensional chip packages and other solutions that put together multiple chips. In advance of the Semicon West conference in San Francisco, ...

Intel has unveiled a new packaging innovation for creating 3D chip packages and multiple chip connections ahead of the Semicon West conference in San Francisco this week. The company is detailing its ...

Like most people in tech, we have oh-so-many questions about Intel's discrete GPU efforts, and if things stay on track, we will get some official answers sometime this year. Until then, we're left to ...

"Hot Chips" isn't just the favorite snack of young people—it's also the name of a technological symposium held yearly in Silicon Valley. We're up to the 34th iteration of the gathering this year, and ...

The organizers of Hot Chips 33 have confirmed an exciting schedule, where we will receive some juicy details on "Advanced Packaging" technology. Intel and TSMC will be discussing their "packaging ...

Rumor mill: The Intel Lunar Lake MX platform is the next crucial step in the company's attempt to prove that x86 can hold back the rising influence of Arm processors in the mobile and low-power ...

Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service providers like ...

Intel has announced plans to invest US$3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including its Foveros 3D packaging ...

Intel is expanding its New Mexico operations to manufacture new generations of chips based on its Foveros 3D packaging technology, a move that could aid the company’s attempts to regain its leadership ...