Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Intel (INTC) is diving deeper into robotics with new chips and software, the company revealed on Thursday. The move comes via Intel's new Intel Robotics AI Suite software package, which includes ...

Intel is unveiling packaging innovations for creating three-dimensional chip packages and other solutions that put together multiple chips. In advance of the Semicon West conference in San Francisco, ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

Samsung is considering using Intel’s packaging and glass substrate technology to give its production line a boost. The tie-up between the firms might elevate their game and could finally outperform ...

One day we might see on-package DRAM, even. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. Add us as a preferred source on Google Intel's taken ...