SK hynix, a major player in the memory manufacturing industry, is gearing up to enhance its advanced packaging capabilities ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

SMART’s XMM CXL ™ Memory Module is designed to meet capacity and bandwidth needs for server and data center applications and workloads NEWARK, Calif.--(BUSINESS WIRE)--SMART Modular Technologies, Inc.

Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic alliance to ...

Of all the PC-related things to come out of CES this year, my favorite wasn’t Nvidia’s graphics cards or AMD’s newest Ryzens or Intel’s iterative processor refreshes or any one of the oddball PC ...