Architects and front end designers usually leave the back end to the physical designers: they know there can be different numbers of metal layers, but may not realize the characteristics of each metal ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

Cambridge, MA – MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one ...

This course presents in-depth discussion and analysis of pn junction and metal-semiconductor contacts including equilibrium behavior, current and capacitance responses under bias, breakdown, ...

Seoul National University’s College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...

Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...