(Substrate U.S., San Francisco, California) A startup founded in 2022 by brothers James and Oliver Proud that plans to build an AI chip foundry with the most advanced technology by 2028. While the ...

Using light beams instead of wires, a team of engineers led by Professor Andreas Andreou at Johns Hopkins University (Baltimore, MD) has devised a means to significantly increase how fast signals move ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more efficient link. The process involves making bumps on the chip, lining it up ...

Samsung Electro-Mechanics and LG Innotek on Wednesday showcased their latest package substrates for the artificial intelligence, server and automotive sectors at a components industry exhibition. The ...

The expansion of demand for artificial intelligence (AI) is energizing industries across the board. One of the hottest emerging markets in this ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

Odisha is emerging as a significant player in advanced sectors like electronics and semiconductors with the inauguration of ...

Apple (AAPL) and Qualcomm (QCOM) are concerned about the strained supplies of Japan's high-end glass cloth fiber, Nikkei Asia reported. Glass cloth is a vital part in chip substrates and printed ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

India's first advanced 3D glass chip packaging unit to be set up in Bhubaneswar with Rs 1,943 crore investment, boosting ...

In a major boost to India’s semiconductor ambitions, Odisha is set to witness the arrival of one of the world’s most advanced chip packaging technologies, with the groundbreaking of the Heterogeneous ...