Electronic Design

Magnetic Packaging Helps Slash DC-DC Module Size Even Further

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...
Electronic Design

Advanced Package Design Fosters Smaller, More Efficient Semiconductors

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Automation World

Module Type Package: Easier and Faster Systems Integration

Module Type Package is an exciting technology that stands to make the integration of machines into a higher-level DCS, SCADA or MES significantly easier and faster. It is an open standard and ...
sciencex

A novel package for high power density SiC power modules

A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Semiconductor Engineering

System-In-Package Thrives In The Shadows

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...
Semiconductor Engineering

MIS Packaging Takes Off

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...