ON Semiconductor is combining the company's Insulated Metal Substrate Technology (IMST) with its broad power solutions portfolio and longstanding expertise in efficient power management. ON ...

As integration and switching rates increase rapidly, the concentration of heat losses is similarly changing. The continuous trend to shrink die size steadily increases the amount of heat to be ...

A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.

Power modules are high-power switching circuits that convert DC- in AC-currents in electric vehicles, renewable energy, and many more applications. New materials [14] and device technologies [14], ...

The power modules target electric drive systems with power density, lower losses, & heat control, covering voltage & current ...

CHANDLER, Arizona--(BUSINESS WIRE)--Rogers Corporation (NYSE:ROG) (“Rogers”), announced its plan to build a new factory in China to manufacture its curamik® AMB (Active Metal Brazed) and DBC (Direct ...

STMicroelectronics has introduced five silicon carbide (SiC) MOSFET-based high-power modules for electric vehicles (EV) that improve performance and driving range. The new SiC power modules cover a ...

Current simulation and verification methods for power modules are time-consuming. Each domain has specific solutions based on finite elements analysis, computational fluid dynamics and solvers for ...

Wide-bandgap semiconductors and electromobility pose completely new challenges for packaging and interconnection technology. For this reason, the European Center for Power Electronics (ECPE) organized ...

More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...