As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified ...

ON Semiconductor is combining the company's Insulated Metal Substrate Technology (IMST) with its broad power solutions portfolio and longstanding expertise in efficient power management. ON ...

As integration and switching rates increase rapidly, the concentration of heat losses is similarly changing. The continuous trend to shrink die size steadily increases the amount of heat to be ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.

CHANDLER, Arizona--(BUSINESS WIRE)--Rogers Corporation (NYSE:ROG) (“Rogers”), announced its plan to build a new factory in China to manufacture its curamik® AMB (Active Metal Brazed) and DBC (Direct ...

SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a ...

A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.

Zuken, a specialist in the area of software and solutions for electronic and electrical engineering, and the Compound Semiconductor Applications (CSA) Catapult have announced an important milestone in ...

STMicroelectronics has introduced five silicon carbide (SiC) MOSFET-based high-power modules for electric vehicles (EV) that improve performance and driving range. The new SiC power modules cover a ...

Power modules are high-power switching circuits that convert DC- in AC-currents in electric vehicles, renewable energy, and many more applications. New materials [14] and device technologies [14], ...

More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...