In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...
Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
A new technical paper titled “MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures” was published by researchers at University of Wisconsin–Madison, Washington State ...
Siemens Digital Industries Software is adopting a new approach for sharing accurate thermal models of IC packages to the electronics supply chain. The main advantages are protecting IP, enhancing ...
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