Before circuit design can begin on any advanced semiconductor manufacturing process, the electrical behavior of the devices — transistors, diodes, resistors — must be described accurately in so-called ...
AUSTIN, Texas--(BUSINESS WIRE)--The Si2 Compact Model Coalition has released the latest version of BSIM-CMG FinFET, a standard compact SPICE model developed by researchers at the University of ...
A SPICE model based on the BSIM3 core eliminates shortcomings in the existing level 1 and level 3 subcircuit models, enabling better simulation of trench-type power MOSFETs. An improved SPICE model ...
YOKOHAMA, Japan--(BUSINESS WIRE)--Semiconductor Energy Laboratory Co., Ltd. (SEL) and Silvaco, Inc. today announced that they have jointly developed a SPICE model of oxide semiconductor FETs (field ...
SAN FRANCISCO — The Compact Model Council (CMC) has selected the PSP model, jointly developed by Pennsylvania State University and Royal Philips Electronics, as the next generation industry standard ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback