Silicides — alloys of silicon and metals long used in microelectronics — are now being explored again for quantum hardware. But their use faces a critical challenge: achieving phase purity, since some ...

Chiplets and advanced packaging have been on the cutting-edge of electronic technology for a while, but Intel is changing where it might be headed. Today’s organic substrates, like Ajinomoto build-up ...

Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...

In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

A research team maps the key tasks that define modern enzyme engineering—function annotation, structure modeling, and property prediction—and explain how AI methods now accelerate each step, from ...

Silicides could advance quantum hardware, but phase purity is difficult; a new study finds hafnium oxide substrates help stabilize the superconducting phase. (Nanowerk News) Silicides — alloys of ...