Engineers discovered hidden cracks in flexible electronics and proposed a new design that could make foldable devices and solar cells more durable. (Nanowerk News) From health monitors and ...

I’m not talking about carnival funhouse mirrors, but rather the different options for mirroring symbols, vias, and bond fingers in your IC Package layout. The Allegro Package Designer Plus and SiP ...

Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...

Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

Graphene appears wetting transparent, yet mirrors substrate charges at the nanoscale, reshaping nearby water structure and ...

Polydimethylsiloxane (PDMS or silicone) is an important and versatile material used in the field of printed electronics (PE). In particular, thin film layers of PDMS show great promise for use in ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

Clorox has patented a method for creating multi-layer substrates using a thermoplastic material that allows for the passage of cleaning compositions between layers. The process involves bonding the ...

The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11 billion in 2024 and ...