Since about 2015, when Don Bartusiak, the then chief engineer at ExxonMobil Research & Engineering, publicly advocated for the development of a new, standards-based, open—yet secure—process control ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Recent Electric Power Research Institute (EPRI) research aims to better understand the potential of process control enhancements, such as load control, sliding pressure control, and steam temperature ...
The lower fuselage half of the Multifunctional Fuselage Demonstrator (MFFD) being assembled at SAM|XL, shown here with conduction-welded stringers and ultrasonic spot-welded clips. Photo Credit: ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback