A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

A new technical paper titled “TA3D: Timing-Aware 3D IC Partitioning and Placement by Optimizing the Critical Path” was published by researchers at Pohang University of Science and Technology and Baum ...

The semiconductor industry is turning to 3D integrated circuits (3D ICs) to meet increasing demands for high performance, miniaturization and energy efficiency. By stacking dies into 3D assemblies, we ...

A new process for creating interconnects on ICs using high-conductivity 2D graphene films could enable production of smaller, faster, cooler-running devices than those using today’s copper ...