Digi Times

Wire-bonding to be increasingly needed to process car-use IGBT, SiC modules, says K&S VP

As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide) power modules and is ...

Quectel Introduces SH602HA-AP Smart Robotic Computing Module to Power Next Generation of Robotic Devices

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart ...
Financial Post

Quectel Debuts Innovative SRG091X and SRG093X NXP i.MX Based Series Modules with Wi-Fi 6, Redefining Entry-level Processing for Next-generation IoT Applications

LAS VEGAS — Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today unveiled its SRG091X and SRG093X series modules at CES in Las Vegas, delivering integrated CPU, memory and ...

Quectel Introduces FGMC63N Tri-Band MCU Wi-Fi 6E Module Alongside Dual Band FGMC62N to Fill Critical Gaps in Next-Generation Wireless Product Design

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, has unveiled the FGMC63N, the industry’s first tri-band MCU Wi-Fi 6E module, at CES in Las Vegas. Supporting operation across ...