Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design ...
In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...
Wacom’s IFA announcements thus far have centered around the company’s consumer-facing Bamboo line. Earlier this week, the tablet maker showed off two new versions of its sketchpad digitizer, in ...
WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...
The semiconductor industry is turning to 3D integrated circuits (3D ICs) to meet increasing demands for high performance, miniaturization and energy efficiency. By stacking dies into 3D assemblies, we ...
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
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