Electronic Design

Finding a Path to 5.5G and 6G Adoption in Process Control

The next steps beyond 5G promise great advantages in terms of bandwidth and latency, making possible many new process-control ...
Semiconductor Engineering

Simplifying ESD Protection and Inter-Chiplet Signaling In Future 2.5D/3D Packaging Technologies (Arizona State, Univ. of Minnesota)

A new technical paper titled “Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal ...
Semiconductor Engineering

Calibre 3DPERC: Your Key To Robust ESD Solutions For 3D ICs

What’s different about electrostatic discharge in stacked-die architectures.
EDN

High-voltage SiC MOSFETs power critical energy systems

Navitas is now sampling 2.3-kV and 3.3-kV SiC MOSFETs in power-module, discrete, and known good die (KGD) formats.
IEEE

Application of Fuzzy Logic Sliding Mode Control Approach With PID Structure for Electro-Hydraulic Actuator Tracking System

Abstract: The electro-hydraulic actuator (EHA) system generates a trajectory by transferring high force densities in the form of pressurized fluid flows to a hydraulic actuator. Moreover, the sliding ...
IEEE

Robust IT-2 Fuzzy Logic Control for Magnetorheological Suspension System With Approximate Hysteresis Nonlinearity

Abstract: The magnetorheological fluid (MRF) damper is a crucial component for vibration energy absorption and dissipation, and the dynamic performance of the MRF damper can be characterized by the ...