In an effort to protect product authenticity and reduce retail fraud, Corsair has revamped its Vengeance DDR5 memory packaging so you can see exactly what's inside.
Corsair is putting its high-end RAM in a sealed plastic clamshell to help prevent return-related scams.
Sky-high memory prices are making theft and fraud more prevalent, but Corsair thinks it has a solution to the disappearing RAM problem.
China's domestic memory module maker Biwin Storage Technology has released the A-share market's first major 2025 profit outlook, signalling a sharp earnings rebound as memory prices recover and ...
Reports out of Taiwan indicate that memory packaging and testing services are getting more expensive, with several suppliers moving pricing up in a significant way. Industry sources claim that major ...
DRAM devices handle data transfer to and from the CPU in computer systems. DRAM modules are used in many applications from desktop PC motherboards to notebooks, servers and PDAs. As the demand ...
Earlier this month, Corsair rolled out a new packaging design for select DDR5 products. The shift reflects a market under strain: chipmakers are posting record revenues, ...
Increasingly, memory chips—in combinations of all their flavors, including DRAM, SRAM, and flash—are at the forefront of microelectronics end-product functions. This scenario is true for cell-phone ...
According to Taiwanese DRAM module assemblers, Hynix Semiconductor may soon become the first major DRAM die manufacturer to outsource packaging and testing for its own-brand memory modules. Sources ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results