Stacked For The Future: How 3D DRAM Stacking Will Transform AI Hardware

Superchips are redefining the backbone of AI and computing, requiring more memory to meet increased demands. As AI models scale in size and complexity, the need for specialized solutions capable of ...
Semiconductor Engineering

Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding (U. of Edinburg, Peking U., Cambridge et al.)

A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...