Since about 2015, when Don Bartusiak, the then chief engineer at ExxonMobil Research & Engineering, publicly advocated for the development of a new, standards-based, open—yet secure—process control ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
A medical device manufacturer ditched a clunky ERP module for quality inspection, opting instead for specialized statistical process control software. Upgrading to new software costs time and money ...
Recent Electric Power Research Institute (EPRI) research aims to better understand the potential of process control enhancements, such as load control, sliding pressure control, and steam temperature ...