Manufacturing Technology Project is our Startup of the Month! It developed a platform to reduce errors in metal 3D printing.

While these approaches are highly effective for linear and well-defined problems, they face increasing challenges when addressing nonlinear behavior, multiphysics coupling, and multiscale phenomena.

Computational mechanics plays a foundational role in engineering and scientific research, traditionally relying on numerical methods such as the finite element method to solve governing equations.

COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all physics delivers up to 5× speedups in benchmarks. COMSOL now supports GPU ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

All-solid-state battery configuration with the abstract model. Various surface coating strategies are investigated by the proposed multiphysics model in terms of electrochemical-mechanical coupled ...

Abstract: Multiscale multiphysics modeling, design, and simulation-based nanomaterial and nanostructure have emerged as a powerful tool revolutionizing engineering and technology to serve as a ...

COMSOL Multiphysics is a comprehensive simulation software platform that enables engineers and scientists to model and analyze multidisciplinary physical systems. By integrating multiple fields of ...

In this article, we speak to a number of leading mainstream CAD developers to bring you a sneak peek into this future. The 2026 event returns to New York, bringing together industry leaders and other ...

The “IO Wall” problem, in which the gap between computation rate and data access rate grows continuously, poses significant problems to scientific workflows which have traditionally relied upon using ...

Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...