How PV modules are treated at the end of their life is an increasingly important issue, but some recycling practices leave a lot to be desired. Scott Azevedo from Intertek CEA explores how asking the ...
However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...
The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...
Embedded silicon capacitors, or ECAPs, aim to solve issues of power integrity from inside the processor’s package.
The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.
The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability, and scalability. Integrated power modules help streamline design, reduce energy ...
CHANDLER, Ariz., Feb. 03, 2026 (GLOBE NEWSWIRE) -- The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and scalability. Integrated ...
Abstract: As materials and fabrication processes advance, the medium voltage (MV) silicon carbide (SiC) power semiconductors featuring exceptional electrothermal properties are emerging in high-power ...
The American Institute for Packaging and the Environment (Ameripen), a policy and advocacy organization representing the packaging value chain, recently launched its “Power of Packaging” website.
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